PXI Express Chassis. 0 specification for use in Mil/Aero VPX systems. Ordering Information: Dawn P/N 11-1017332-01. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). Revolutionary design allows for up to 175 watts per slot of conduction cooling. Open VPX backplane with VITA 62 power slot. External cooling configurations include natural convection cooling, forced air (fan) cooling and. CP949 is a 7-port Ethernet switch in a conduction cooled, single-slot 6U CPCI form factor. 3VIO, Short tail connectors on J1, long tail connectors on J2. It supports up to two 0. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. From conduction cooled to air cooled, from simple passive (power burning) resistor boards to active, monitored and controlled load boards, the customer has a variety of load board solutions to choose from. 2. 11 modular extrusions. 3U/6U High ATR Chassis with upto 15 Slots Card Area. It consists of a tunable laser(s), i wavelength tagging Michelson intefferometer, an optical distnl_Jti_“The solution there is primarily conduction cooling, dissipating 100 to 150 watts per enclosure, with a ceiling of more than 40 watts per slot in a 6U form factor. It is conduction-cooled through the card edge/wedgelock. CompactPCI Serial Chassis. Conduction Cooled. This GE Fanuc / Radstone PPC2EP-603-5CG VME Conduction Cooled Single Board Computer is new from surplus stock. Systems Integration Plus, Inc. Hartmann Electronic’s 4 slot 19” rack mountable VME solution – The VME64x 2U system. 62. In addition to theseThe Conduction Cooling Experts: Advanced Thermal Management Equals Reliability With a heritage of more than 30 years, Curtiss-Wright has long been recognized as the COTS industry’s leading expert in the design of conduction cooled standards based modules. Heat frames can be designed for compliance with many industry standards. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. Boards are inserted in the back of the chassis in a vertical orientation. 1 PICMG 2. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. 11 modular extrusions. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. VME64x 2U/84HP 4 Slots. pdf;Physical Characteristics. manufactures a variety of rugged modular conduction cooled chassis as well as 19” and 19” 1/2 form factor enclosures and a full range of 3U and 6U COTS modules for VPX , VITA 73 and CPCI applications. CompactPCI Serial Chassis. 08 of Vita65. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. Ordering Information: Dawn P/N 11-1017332. Permissible Current Load: 5V_VS3 0A. Because VITA 48. Tested to MIL-STD-810, VITA47. Up to 128 Gbytes DDR4 memory for server grade applications. Thermal design, simulation and analysis services. 16. Air cooled, conduction cooled and liquid cooled options. The stronger the need for computer power, the more. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. 1-1997 while providing a low profile, practical packaging solution for high-performance. Block Diagram. 2 (REDI) and VITA 65 (OpenVPX™) † 6U, 7-slot backplane, 1” pitch per VITA 65 Backplane Profile BKP6-CEN07-11. Defense applications require a range packaging approaches. Chassis Type: ATR Chassis Cooling: Forced Air Module Cooling: Conduction Number of Slots (1″ pitch): Various Operating Temp. The 50HP wide, rack-mountable enclosure for vertical mounting of boards is outfitted with a 300W ATX power supply and a 1U removable, bottom mount fan tray. System. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. About. The Nova Integration Solutions 3000 Series consists of a family of custom and standard ATR reference designs and enclosures also referred to as a chassis, in support highly rugged and MIL spec. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. The CHAMP-XDx family of modules features some of the most sophisticated thermal frames yetW-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Chassis is capable to provide withstand Shock and Vibration defined by MIL-STD-810 as followed: - Shock: 40G in both Positive and. +70°C, ≤ 8 slots: -40°C. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. {1/2 Slot, 3/4 Slot, Full Slot ATR VME Enclosures MIL [Military]/Rugged, conduction cooled} American Rugged Enclosures 'ARE' {SEM E, Conduction Cooled ATR Chassis, 3 - 21 Slots} CM Computer {5/7/12 Slot ATR chassis supporting VME32 and VME64x backplanes, 1/2, 3/4, 1 ATR Long size} Curtiss Wright. CompactPCI Serial Chassis. (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches. We offer air & conduction cooled power supply units for wide range AC as well as DC input. μTCA Conduction Cooled Chassis ½ ATR with 6 AMCs. 62H. Dawn’s 3U form factor conduction cooled chassis for cold plate deployment is designed for all rugged environments; Airborne, Land and Sea. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Conduction Cooled Version of Pixus VPX Chassis Manager. Configuration: • No Modules Installed. SOSA™ Aligned Technology CapabilitiesThis rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. Hundreds of processors chipsets and thousands of peripheral chips utilize PCI. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Versions in alignment with the SOSA (TM) Technical Standard. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. PXI /. 8” and 1. With moveable rear profiles (up to 2. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. pdfA VME Chassis will be between 1 and 21 slots (the maximum). Important Notice: Other accessories, manuals, cables, calibration data. VPX combines best-in-class technologies to assure a very long technology cycle. This switching power supply accepts a +5 VDC input and converts it to a single +3. The heat from the internal conduction-cooled. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Development chassis for VPX and SOSA aligned module payloads. Aluminum card guides can be assembled in place of polycarbonate with optional conduction cooled card guides, if needed. RuSH controlled power and cooling supports high current demands and corresponding. Description. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Min. 0 specifications. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. CompactPCI Serial Chassis. Related products. 20 based. With moveable rear profiles (up to 2. 2-7. 3U Conduction Cooled VPX Extender with Fan Option. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. The aim is to ensure mechanical interchangeability of conduction-cooled circuit card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and double-height (6U) x 160mm, Euroboard chassis. Test chassis can test up to 6 Conduction Cooled VME 6U cards. Intelligent VPX Test Module, also System Monitor and Load Board. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. VME64x 1U/84HP 2 Slots. or 1. Operating temperature range is -40°C to +85°C. Aitech Defense. Part Number: 11-1011777-2119. manufactures a variety of rugged modular conduction cooled chassis as well as 19” and 19” 1/2 form factor enclosures and a full range of 3U and 6U COTS modules for VPX , VITA 73 and CPCI applications. The mini crate can be used on the desk either as a desktop or up-right unit or be installed in a 19. Just think of the entire electronics cabinet as a giant heat sink. This specification is applicable to, but not limited to, the VMEbus standard, an internal interconnect (backplane) bus intended for connecting processing elements to their immediate fundamental resources. ACT manufactures copper/water heat pipes into two basic geometries: Tubular Heat Pipes and Planar Heat Pipes. 6U/ 5HP VPX load card, conduction cooled. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. XCalibur1931. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. Product Information ATR Chassis For Conduction-Cooled VME Boards Available in multiple ARINC 404A sizes: 1ATRLong, 1ATRShort, 3/4ATRShort, 1/2ATRShort Choice of cooling options: – Fan assisted with integral fan – Using air ducted through a rear plenum – Conduction through base or sidewall – Liquid Pluggable 28 VDC, 115 VAC and 270VDC. pitch conduction-cooled VPX (VITA 48. Application. pitch air-cooled VPX (VITA 48. Stock # 74927-1 . Rugged Conduction Cooled Assemblies and Modules. The tubular heat pipes typically have outer diameters from 1/16″ (1. 2 conduction-cooled VME chassis or ANSI/VITA 1-1994 standard air-cooled chassis. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. 3V_Aux. The P0CC1 6U PMC Carrier is a single slot replacement unit supporting two single or one double width PMC which can beForm Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. C: -40 Operating Temp. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. PXI /. Level 1-5 Air, Conduction Cooled : Optimized for lower power consumption : DSP221: PCI Express, VXS 6U, XMC/PMC : QorIQ T2081 @ 1. VMEbus System, 7 U, 12 Slot, Open Frame PSU. Factory programmable power sequencing of all voltage rails. Revolutionary design allows for up to 175 Watts per slot of conduction cooling; Precision machined from 6061 T6 Aluminum; Corrosion. 8 slot conduction cooled 3U VPX chassis; 6 SSD removable drive bay; Minimal Cables / Edge Card; Multiple configurations, interfaces, and integrations. The ICE-Lok® thermally enhanced Wedge. 3 V. 8” slot. 12”W x 19. 8 (. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. Elma’s line of rugged Air Transport Racks (ATRs) provide ideal cooling and reduced weight through superior. 64PS1 - North Atlantic Industries. Kontron's standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. VPX breaks out from the traditional connector scheme of VMEbus to merge the latest in connector and packaging technology with the latest in bus and serial fabric technology. pitch conduction-cooled CompactPCI modules. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. CompactPCI Serial Chassis. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. 0 specification for use in. sets itself apart from other rugged electronic packaging suppliers by specializing in engineered packaging solutions, primarily for military, heavy industrial and aerospace applications. The VT874 is designed for the rugged extremes of avionics, naval, and ground vehicles applications. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. PXI Express Chassis. Description. PXI / PXIe Chassis. PSC-6236 Product DatasheetLiquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Cooling: Air flows around a finned, conduction cooled internal, sealed chassis and exits rear of chassis pulled by a single exhaust Tubeaxial. 20 dimensions for conduction cooling, and meets the VITA 47 ECC4 ruggedization specifications for shock, vibration, and operating temperature range of -40° C to +85° C. 2 (REDI) and VITA 65 (OpenVPX). Operating Temperature > 8 slots: 0°C. Hartmann Electronic’s slimmest 19” rack mountable VME solution – The VME64x 1U system. These PSUs are available in 3U or 6U form factor. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. 3U VITA 62 compliant universal AC input 400 watt 6 channel plug-in or bulkhead mounted power supply for air or conduction cooled OpenVPX systems. 8 in. Conduction-cooled rugged VME boards fully comply with IEEE 1101. The high-density components that enable high-speed I/O also use more power, making advanced cooling methods essential for rugged VPX designs. Supplies are configurable through a user menu and may be operated in normal or battle short mode. 8 GHz : 2x PMC/XMC : Rugged Air Cooled and Conduction Cooled : Available in multiple ruggedization levels : SBC314C Flight-Certifiable Single Board ComputerVPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. Utilizing our extensive experience in embedded. Subrack based, sheet metal, desktop or tower configurations. Single/dual cooled side walls. 0” slot pitch), and can also accommodate mezzanine cards as needed. 10 Mechanical standards; 6U (VXS/ OpenVPX/VPX/VME64x / cPCI) Backplane Options; 1U to 11U High Card Area; 2 to 21 Slots; Custom specific Switch Controls and indications; Forced Air Convection Cooled; AC / DC Input power supply; EMI/RFI. Unlike the original Eurocard solutions such as VME, which use connectors with a 0. For a chassis with sealed side walls and lid. The power supply is plugged into rear behind the fan tray. or 1. CAD templates and 3D printed prototypes available. Provision for mounting GPS/1PPS/10MHZ source in the chassis. VXS (VME Switched Serial) represents an extension of the VME family according to VITA 41. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane. 0 specification for use in Mil/Aero VPX systems. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. pitch, high-bandwidth backplane, and 400 W power supply. Compared to conventional wedge locks, the ICE-Lok creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. Mounting Style: Desktop. or 1. 3 V. 0 in. The heat frame provides the following functions: Provides rigid support and structure to the PCB board against shocks, such as the vibrations in an airplane; Interacts with the chassis and utilizes conduction cooling to cool down the PCB boardCan be provided in a range of ATR sizes. Radstone or third-party ATR style enclosures. 62”H; 1ATR ARINC 404A Tall/Long format Weight: TBD Electrical Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. pdf; VPX-6U-RiCool-High-CFM-Chassis-Datasheet. An assortment of lab chassis with DSUB rear I/O, extenders and bus extenders round off the classic product line. Another popular VMEbus card style is the conduction cooled module. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. 62H. The convection bridge is clamped between the VME. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. Description. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. A&A Performance Chassis : 3352 Compton Rd. 6U / VITA 62 / 580W. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O. 600-Watt DC/DC Converter, 6U VME. The ICE-Lok® can be seamlessly. as. Conduction cooled base coupled, via short and efficient path, provides for optimum cooling. Conduction Cooled VMEbus Modules. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. 8” slot. Input Transients as per MIL-STD-704E / MIL-STD-1275D. The PSC-6265 operates continuously at a. Terminal, 8 slots: On-board Schottky barrier diodes. VME 64x 6U 166 Series. Full environmental sealing insures reliable operation in any. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. {Tower-Desktop-Industrial-Rugged-[Military] to 901D} Extreme Engineering Solutions {VPX and CompactPCI Development Platforms, Deployed Systems, ATR, rugged, air- and conduction-cooled, Integrated Systems} Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. Designed for 6U Conduction Cooled Boards; Machined Aluminum 6061-T6 Construction; Front Load Design; Circular Connectors, indicators, and controls on Side Panel; Supports 6U backplanesPCI Systems Inc. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. 08 of Vita65. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. Load sharing circuitry for up to 4 modules. Built with aluminum the chassis are suitable for rugged airborne applications and can operate in under extreme temperatures, dust and humidity. Open VPX is the architecture framework that defines system level VPX interoperability for. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid VME64x/VITA46/48 VPX 5-slot Development System VME-VME64 6U 162 Series. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. Conduction Cooled Version of Pixus VPX Chassis Manager. 1/2 ATR, conduction-convection cooled. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. The VME195-x mini crate is the perfect choice for small setups with only a few VME64x modules. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Conduction Cooled Assemblies consist of a conduction-cooled frame, backing plate or backing strips, extractors and wedge clamps. A means to utilize conduction-cooled VME electronics mod ules in an air cooled system is provided. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. +85°C. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. Different widths and combinations of 3 and 6U slots are available also. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. 8 in. DEV. Conduction-Cooled. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. 87"W x 3. downloads. Such means com prises a modified convection-cooled VME compatible chas sis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Victoria BC : 250-727-2890 ©2010 A&A Perfomance Chassis: Site Design by. While Hartmann Electronic thrives on the development and production of high-speed backplane technology, what good would our backplanes be without a high-quality enclosure?Accommodates up to ten 6Ux160mm conduction cooled VPX cards. 15A in 1A steps, +12V_AUX 0. Type 12R2, 9U, 19" Rackmount, MIL-Rugged, Vertical Chassis. Rhino - 3U/6U Conduction Cooled. 6U CompactPCI. Level 4-5 Conduction Cooled 1; Levels 1 through 3 and 5 – Air, Conduction Cooled 1;. Operating Temperature > 8 slots: 0°C. The heart of the C164 is Intel’s Broadwell platform, featuring a 5th Generation Intel® Core™ i7 Quad Core processor with integrated Intel® Iris™ Pro Graphics 6200, coupled with a companion Lynx Point. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. 31 in) / PCB + (7. Airborne, shipborne and ground deployment. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1″ pitch per VITA 65 Backplane Profile BKP6-CEN07-11. 10-core processor for high performance. Description. 9 mm) Design Feature: Tolerance Compensating. Thermal design, simulation and analysis services. X-ES / Extreme Engineering Solutions XPand4200 Standard Sub-1/2 ATR Forced Air-Cooled Chassis for Conduction-Cooled Modules. Subrack based, sheet metal, desktop or tower configurations. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. An open-frame solution for the open-minded engineer. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 0 specification for use in Mil/Aero VPX systems. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. High Quality Chassis and Enclosures for VME and VME64x Applications. PXI /. The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. Our modular, aluminum chassis variants give you many different and interchangeable options for VPX and cPCI, as well as our rugged small form factor VITA 73. 8” slot. e. <br /> If you’ve ever dreamed about controlling<br /> your VME system directly from your desk-<br /> top system, your dream. 3-n. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Card Thickness: 2. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. About - 1-ACT. The aim is to. It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. The heat from the internal conduction-cooled modules is. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. 1, IEEE 1101. The VT874 provides three AMC mid-size slots that can accept any AMC. Built with aluminum the chassis are suitable for rugged airborne applications and can operate in under extreme temperatures, dust and humidity. Backplane: Custom 6U, 10 slot open VPX Backplane (Dawn P/N 08-1017654 Rev. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through internal. 2 specification. 28 - 0. The XPand1201 is a low-cost, flexible, development platform. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. Packaged as a single-slot VME module, the conduction-cooled ruggedized C5100-R conforms to the IEEE 1101. Chassis is cold plate base coupled conduction cooled and rated for operation over -40 to +85°C range. Utilizing our extensive experience in embedded. Convection and Conduction cooled ATR (Air Transport Rack) enclosures offer a standardized, cost effective solution for PCI, VME, VME64x, VXS, cPCI and. PSC-6238. The PSC-6238 front I/O. Related To: Dawn VME Products 6U VME64x 195-x Mini Chassis. VME 11; PCI Express 10; cPCI 3U 9; 3U VPX 8; Software 6; Thunderbolt 3 6; VXI 6; 3U 5; cPCI 6U 5; PCI 4; ISA 3; Mini PCI Express 3;. Supports air cooled and optionally conduction cooled boards. 2, VITA 30. 8 does not use module-to-chassis conduction cooling, it also promises to help drive innovative use of new lightweight polymer or composite material-based chassis. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. The standard model is conduction to wedge lock cooled with an operating temperature range of -40C to +85C and a non-operating range of -55C to +105C. The system is designed with enhanced EMC features. Designed for mission critical applications. Full environmental sealing insures reliable, all-conditions operation. Introduction. 600-Watt DC/DC Converter, 6U VME. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. It is conduction-cooled through the card edge/wedgelock. With 6U-VME conduction cooling, power dissipation per slot is limited by the cold plate on which the chassis is mounted. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Performs an amazing range of applications, and tests such as OpenVPX Rule Compliance testing and certification, system design validation and characterization. These rugged enclo-sures are available to support either one-inch or 0. PXI /. 3U 11 Slot OpenVPX Devlopment System. This 4U x 19-inch deep chassis can either be mounted in a 19-inch rack or used as a table top unit. Rugged rackmount solutions in various formats. Rather than a single specification, VPX is a set of base, environmental, mechanical and dot specifications, defining several – mainly rugged – capabilities and features for new VITA-compliant systems. CompactPCI Serial Chassis. SOSA™ Aligned Technology Capabilities Rugged Chassis for Mobile Military/Aerospace Applications Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses; Environmentally Sealed; Compact and Lightweight with 5 Standard VME64x Slots; Internally Conduction-Cooled; Externally Cold Plate Cooled; Fully Sealed Faraday Cage and Complete EMI/RFI Power Line Filtering Cooling: Air flows around a finned, conduction cooled internal, sealed chassis and exits rear of chassis pulled by a single exhaust Tubeaxial high air flow 28V exhaust fan (can be powered with internal AC supplies) – less expensive option desired Liquid cooling, typically at the base, relying on conduction from chassis; Air cooling, using fins directly attached to the chassis sidewalls; HIK™ CARD FRAMES SOLVE THERMAL MANAGEMENT CHALLENGES. Load boards convection or conduction cooled • Rear Transition Modules for I/O • Intel & Freescale Single Board Computers • Blade level networking boards (Ethernet, PCI Express) • Rackmount, desktop, and ATR chassis platforms • Ruggedization programs 6U 7-Slot OpenVPX Backplane BKP6-HYB07-11. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. Meets ARINC 404A and. CompactPCI Serial Chassis Platforms. It is conduction-cooled through the card edge/wedgelock. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Chassis. Additional backplanes are available, including VME,. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. PSC-6265. VITA Conduction Cooled Assemblies, 6U260VITA48. Dawn’s VITA 62 compliant 6U PSC-6265 can operate continuously in diverse environments over a wide range of temperatures at high power levels. Our selection of Intel, NXP Power. This Model Can be used to design the VITA Card Chassis. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. An optional hold-up module will be available to support. Item Description. Ability to work with existing board, frame, or chassis designs. 2-16 VPX slots at 1” pitch. Communications Intelligence (Ground Mobile) SIP designs communication and signals intelligence computers for rugged ground mobile applications. 5 Hz 20fe_ 0. Max. 0 specification for use in Mil/Aero VPX systems. 62H. heat to the chassis walls and finally to a cold plate. This helps multi-sourcing, and means that a range of chassis architectures is available to suit different deployed scales and architectures. 6U CompactPCI. 8” slot. 3U/6U Short/Short, Short/Long, Tall/Short, Tall/Long & Dwarf to 1 ½ ATR Chassis. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. Other connectivity options are available, such as runningVME64x 1U/84HP 2 Slots. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. The chassis interface 400 comprises convection bridge heat exchanger 402, standard 6U VME electronics module 404, a heat flow 406, an air flow 408, a card slot pitch height 410, generic 6U VME backplane 420, generic 6U VME connectors 412, a modified chassis side panel 414, a wedgelock clamp 416, and non-conduction-cooled standard 6U VME modules. Systems Integration Plus, Inc. Mechanical characteristics of conduction-cooled versions of Eurocard-based circuit card assemblies are described. 16. 1) modules. Add to Cart. 20-n FeaturesDescription. This thin VME chassis comes with a 250W cPCI hot-swap power supply and horizontally oriented card slots. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. View product. Conduction cooled VME electronics Vibration: Card-edgetempen_re: Number of VME modules 20 0. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. Defense applications require a range packaging approaches and LCR has the proven products to meet mission objectives with ATRs for SWaP constrained installations or 19-inch chassis for larger scale computing needs. {VME Rugged Chassis manufacturer} MCH Systems {Rugged retma rackmount and ATR VME chassis}Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. HiK™ card frames increase thermal conductivity. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. AC and DC power input variants available. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. Driven and supported by the PICMG group for more than 10 years, CompactPCI (CPCi) platforms are designed for modularity, ruggedization, Hot Swap, system management and provide densed computing performance, which is supported by optimized air or conduction cooled concepts. SOSA-Aligned 100GbE EcoSystem. , the wedgelock supply is located such that they are also cooled through the bulkhead) Mechanical Meets ARINC 404A ATR System Mechanical Design Overall Chassis Dimensions: 10.